PC Board Level Thermal Products
EcoGreen Technologies provides a wide range of PC Board level thermal products in standard sizes applicable to different electronic devices and allowable space and air flow. The Standard Thermal products come in the form of Stamping, Extrusion, Die-casting & etc. Customised designs to meet customers' requirements are available.
Standard Stamp Heatsink
Standard Stamping Heatsinks applicable to standard electronics devices such as TO-202, TO-218,TO-220,TO3P
Standard Extruded Heatsinks
. Standard Extrusion Heatsink for TO3, 202,220,247 & etc Devices.
. Standard Extrusion Heatsink for TO3P Devices.
. Standard Extrusion Heatsink for High Power Solution.